JPH0410336U - - Google Patents

Info

Publication number
JPH0410336U
JPH0410336U JP5040790U JP5040790U JPH0410336U JP H0410336 U JPH0410336 U JP H0410336U JP 5040790 U JP5040790 U JP 5040790U JP 5040790 U JP5040790 U JP 5040790U JP H0410336 U JPH0410336 U JP H0410336U
Authority
JP
Japan
Prior art keywords
sealing
nozzle
resin
substrate
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5040790U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0713218Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5040790U priority Critical patent/JPH0713218Y2/ja
Publication of JPH0410336U publication Critical patent/JPH0410336U/ja
Application granted granted Critical
Publication of JPH0713218Y2 publication Critical patent/JPH0713218Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP5040790U 1990-05-15 1990-05-15 半導体の樹脂封止装置 Expired - Lifetime JPH0713218Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5040790U JPH0713218Y2 (ja) 1990-05-15 1990-05-15 半導体の樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5040790U JPH0713218Y2 (ja) 1990-05-15 1990-05-15 半導体の樹脂封止装置

Publications (2)

Publication Number Publication Date
JPH0410336U true JPH0410336U (en]) 1992-01-29
JPH0713218Y2 JPH0713218Y2 (ja) 1995-03-29

Family

ID=31568924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5040790U Expired - Lifetime JPH0713218Y2 (ja) 1990-05-15 1990-05-15 半導体の樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH0713218Y2 (en])

Also Published As

Publication number Publication date
JPH0713218Y2 (ja) 1995-03-29

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